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LOCTITE® ABLESTIK ABP 8068TI, Syringe

Henkel
LOCTITE® ABLESTIK ABP 8068TI offers semiconductor packaging specialists a high-performance die attach material for high thermal and electrical lead frame packaging suitable for automotive and industrial applications. Unlike traditional silver sintering materials that need pressure, LOCTITE ABLESTIK ABP 8068TI provides standard die attach processing capability and low temperature curing to form a rigid sintered Ag network in the bulk structure and at the interface.
    Availability: on demand
    Personal consultation
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    Safety Data Sheet (SDS) on request

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    LOCTITE® ABLESTIK ABP 8068TI offers semiconductor packaging specialists a high-performance die attach material for high thermal and electrical lead frame packaging suitable for automotive and industrial applications. Unlike traditional silver sintering materials that need pressure, LOCTITE ABLESTIK ABP 8068TI provides standard die attach processing capability and low temperature curing to form a rigid sintered Ag network in the bulk structure and at the interface.
    Packaging type Syringe
    More Information
    BMC internal key 2698515
    Regional availability on demand
    Brands LOCTITE®