LOCTITE® ABLESTIK ABP 8611, Syringe

LOCTITE® ABLESTIK ABP 8611 adhesive is designed for die attach applications as well as component attach. Its high dielectric property helps eliminate current leakage and short circuit occurance in voltage isolation applications. LOCTITE ABLESTIK ABP 8611 die attach adhesive is formulated with a high modulus and adhesion at wirebond temperatures making the material suitable for use on copper wire bonding applications where die shift issues during processing should be avoided.