close

This is only a sample image of the product.

LOCTITE® ABLESTIK CDF 200

Henkel
LOCTITE® ABLESTIK CDF 200 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm . This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes.
  • High MSL reliability
  • Controlled fillet size
  • Consistent bondline thickness
  • No resin bleed-out
Availability: on demand
Personal consultation
LOCTITE ABLESTIK CDF 200, Hybrid Chemistry, Die Attach

Safety Data Sheet (SDS) on request

/H/e/Henkel_4742.jpg
/l/o/loctite_logo_f5d5.JPG
LOCTITE® ABLESTIK CDF 200 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 5mm x 5mm . This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes.
Packaging type Other types of packaging
More Information
Regional availability on demand
Brands LOCTITE®