LOCTITE® ABLESTIK CDF 500
LOCTITE® ABLESTIK CDF 500 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. It can be used in a variety of die sizes ranging from 3mm x 3mm to 8mm x 8mm.
Availability: on demand
Safety Data Sheet (SDS) on request