LOCTITE® ABLESTIK CDF 600
Henkel
LOCTITE® ABLESTIK CDF 600 silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates.
- Low warpage
- Consistent bondline control with minimal die tilt
- Pre-cut wafer lamination equipment compatible
- Recommended for thin wafer handling applications
Availability: on demand
Safety Data Sheet (SDS) on request
