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Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

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LOCTITE® ABLESTIK CDF 600

Henkel
LOCTITE® ABLESTIK CDF 600 silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates.
  • Low warpage
  • Consistent bondline control with minimal die tilt
  • Pre-cut wafer lamination equipment compatible
  • Recommended for thin wafer handling applications
Availability: on demand
Personal consultation
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK CDF 600 silver filled, die attach adhesive is recommended for large die applications. It is suitable for bonding integrated circuits and components onto laminate substrates.
Packaging type Other types of packaging
More Information
BMC internal key 1870256
Regional availability on demand
Brands LOCTITE®