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LOCTITE® ABLESTIK CDF 800

Henkel
LOCTITE® ABLESTIK CDF 800 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 4mm x 4mm.
    Availability: on demand
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    Safety Data Sheet (SDS) on request

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    LOCTITE® ABLESTIK CDF 800 highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. This adhesive exhibits strong adhesion to various wafer metallizations and leadframe finishes. It can be used in a variety of die sizes ranging from 0.2mm x 0.2mm to 4mm x 4mm.
    Packaging type Other types of packaging
    More Information
    BMC internal key 1759072
    Regional availability on demand
    Brands LOCTITE®