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LOCTITE® ABLESTIK ICP 9000, Syringe

Henkel
LOCTITE® ABLESTIK ICP 9000 is an electrically conductive material that offers high adhesion and low stress for high end power IC packages including, SiC power devices as well as GaAs and GaN die transistors. This product is formulated to offer good workability and no resin bleed-out, as well as high thermal stability. LOCTITE ABLESTIK ICP 9000 is highly reliable and the thermal performance is comparable to solder paste products.
  • Electrically conductive
  • No resin bleed-out
  • Good workability and sintering properties when used on Ag, PPF, Au and Cu substrates
  • High thermal stability
Availability: on demand
Personal consultation
LOCTITE ABLESTIK ICP 9000 is a single component, silver-filled, semi-sintering liquid adhesive that is a solder replacement and specially designed for use in high power and high temperature assembly of electronic devices.

Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK ICP 9000 is an electrically conductive material that offers high adhesion and low stress for high end power IC packages including, SiC power devices as well as GaAs and GaN die transistors. This product is formulated to offer good workability and no resin bleed-out, as well as high thermal stability. LOCTITE ABLESTIK ICP 9000 is highly reliable and the thermal performance is comparable to solder paste products.
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Syringe
Physical appereance Liquid
More Information
BMC internal key 2474169
Colour Silver
Regional availability on demand
Brands LOCTITE®