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LOCTITE® ABLESTIK NCF 218

Henkel
LOCTITE® ABLESTIK NCF 218 transparent film is specially formulated for Pb free, low κ, thin gap, large and thin die used in advance flip chip applications. This material is suitable for die to die, die to wafer (TSV) or die to substrate applications.
    Availability: on demand
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    Safety Data Sheet (SDS) on request

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    LOCTITE® ABLESTIK NCF 218 transparent film is specially formulated for Pb free, low κ, thin gap, large and thin die used in advance flip chip applications. This material is suitable for die to die, die to wafer (TSV) or die to substrate applications.
    Packaging type Other types of packaging
    More Information
    BMC internal key 2415951
    Regional availability on demand
    Brands LOCTITE®