close

Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

This is only a sample image of the product.

LOCTITE® ABLESTIK QMI2569, Bottle

Henkel
LOCTITE® ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal hermetic packages. The material allows for simultaneous processing of die attach and leadframe embedding, while producing a void-free bondline for maximum thermal dissipation. Excellent RGA moisture results are acquired through the use of lead borate glass. LOCTITE ABLESTIK QMI2569 also offers improved processability by allowing in-line drying during the firing process on die as large as 0.800" x 0.800". Either multi-needle or starfish can be used to apply the material. LOCTITE ABLESTIK QMI2569 can only be used in hermetic packaging applications.
  • Void-free bondline
  • Maximum thermal dissipation
Availability: on demand
Personal consultation
LOCTITE ABLESTIK QMI2569, Silver Glass, Semiconductor, Conductive Adhesive

Safety Data Sheet (SDS) on request

/H/e/Henkel_4742.jpg
/l/o/loctite_logo_f5d5.JPG
LOCTITE® ABLESTIK QMI2569 is a silver glass die attach adhesive used for attachment of integrated circuits in both solder seal glass seal hermetic packages. The material allows for simultaneous processing of die attach and leadframe embedding, while producing a void-free bondline for maximum thermal dissipation. Excellent RGA moisture results are acquired through the use of lead borate glass. LOCTITE ABLESTIK QMI2569 also offers improved processability by allowing in-line drying during the firing process on die as large as 0.800" x 0.800". Either multi-needle or starfish can be used to apply the material. LOCTITE ABLESTIK QMI2569 can only be used in hermetic packaging applications.
Packaging type Bottle
More Information
BMC internal key 1431714
Regional availability on demand
Brands LOCTITE®