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LOCTITE ABLESTIK QMI3555R, 2oz jar

Henkel
LOCTITE® ABLESTIK QMI3555R is a low temperature processing, no dry, silver glass die attach adhesive for the attachment of integrated circuits in both solder seal and glass seal hermetic packages. It is designed for fast firing large die or small dies on either gold plated or bare ceramic substrates. The paste fires into a film that provides high thermal and electrical conductivity as well as excellent initial adhesion. It is extremely resistant to degradation during temperature cycling from -65°C to +150°C.
    Availability: on demand
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    Safety Data Sheet (SDS) on request

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    LOCTITE® ABLESTIK QMI3555R is a low temperature processing, no dry, silver glass die attach adhesive for the attachment of integrated circuits in both solder seal and glass seal hermetic packages. It is designed for fast firing large die or small dies on either gold plated or bare ceramic substrates. The paste fires into a film that provides high thermal and electrical conductivity as well as excellent initial adhesion. It is extremely resistant to degradation during temperature cycling from -65°C to +150°C.
    Packaging type Other types of packaging
    More Information
    BMC internal key 1419015
    Regional availability on demand
    Brands LOCTITE®