LOCTITE® ABLESTIK QMI509, Syringe
Henkel
LOCTITE® ABLESTIK QMI509 silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. This adhesive also exhibits a very low modulus, which can reduce inter-package stress. A package or device manufactured with LOCTITE ABLESTIK QMI509 will have good resistance to delamination and “popcorning” after exposure to reflow temperatures. LOCTITE ABLESTIK QMI509 can be cured in a conventional oven, on a snap cure oven, or utilize SkipCure™ processing on a die bonder or wire bonder.
- Electrically conductive
- Stable at high temperatures
- Void-free bondline
- Hydrophobic
Availability: on demand
LOCTITE ABLESTIK QMI509, Bismaleimide Resin, Die Attach, Silver filled Conductive Adhesive
Safety Data Sheet (SDS) on request
