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LOCTITE® ABLESTIK QMI516IE, Syringe

Henkel
When you need a low-temperature curing die attach adhesive for high throughput applications, LOCTITE® ABLESTIK QMI516IE is a great choice. This 1-part BMI hybrid product is also stable at high temperatures, offers excellent adhesive strength to a variety of substrates, and provides a reliable, void-free bondline.
  • Electrically conductive
  • One component - requires no mixing
  • Low temperature cure (90 minutes @ 60°C)
  • Fast curing (60 seconds @ 90°C)
Availability: on demand
Personal consultation
This semi-rigid, electrically conductive, hybrid die attach adhesive is designed for heat sensitive applications​.
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Safety Data Sheet (SDS) on request

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When you need a low-temperature curing die attach adhesive for high throughput applications, LOCTITE® ABLESTIK QMI516IE is a great choice. This 1-part BMI hybrid product is also stable at high temperatures, offers excellent adhesive strength to a variety of substrates, and provides a reliable, void-free bondline.
Packaging type Syringe
More Information
BMC internal key 1289809
Regional availability on demand
Brands LOCTITE®