LOCTITE® ABLESTIK QMI516IE, Syringe
Henkel
When you need a low-temperature curing die attach adhesive for high throughput applications, LOCTITE® ABLESTIK QMI516IE is a great choice. This 1-part BMI hybrid product is also stable at high temperatures, offers excellent adhesive strength to a variety of substrates, and provides a reliable, void-free bondline.
- Electrically conductive
- One component - requires no mixing
- Low temperature cure (90 minutes @ 60°C)
- Fast curing (60 seconds @ 90°C)
Availability: on demand
This semi-rigid, electrically conductive, hybrid die attach adhesive is designed for heat sensitive applications.
Safety Data Sheet (SDS) on request
