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LOCTITE® ABLESTIK QMI529HT-2A1, 10 cc Syringe

Henkel
LOCTITE® ABLESTIK QMI529HT-2A1 conductive die attach adhesive has been formulated for use in high throughput die attach applications. A package or device using this material will have a high resistance to delamination and popcorning after multiple exposures to Pb-free solder reflow temperatures. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.
  • Electrically conductive
  • Void-free bondline
  • Thermally conductive
  • Hydrophobic
Availability: on demand
Personal consultation
LOCTITE ABLESTIK QMI529HT-2A1, BMI/Acrylate, Die attach
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK QMI529HT-2A1 conductive die attach adhesive has been formulated for use in high throughput die attach applications. A package or device using this material will have a high resistance to delamination and popcorning after multiple exposures to Pb-free solder reflow temperatures. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.
Packaging type Syringe
More Information
BMC internal key 846753
Regional availability on demand
Brands LOCTITE®