LOCTITE® ABLESTIK QMI529HT-2A1, 10 cc Syringe

LOCTITE® ABLESTIK QMI529HT-2A1 conductive die attach adhesive has been formulated for use in high throughput die attach applications. A package or device using this material will have a high resistance to delamination and popcorning after multiple exposures to Pb-free solder reflow temperatures. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.