close

Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

  • My Wish List 0
  • My Cart 0

This is only a sample image of the product.

LOCTITE® ABLESTIK QMI529HT, Syringe

Henkel
LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.
  • Electrically conductive
  • Thermally conductive
  • Void-free bondline
  • Hydrophobic
Availability: on demand
Personal consultation
LOCTITE ABLESTIK QMI529HT, BMI/Acrylate, Die attach
Add to Wish List Add to Compare

Safety Data Sheet (SDS) on request

/H/e/Henkel_4742.jpg
/l/o/loctite_logo_f5d5.JPG
LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.
Packaging type Syringe
More Information
BMC internal key 601548
Regional availability on demand
Brands LOCTITE®