LOCTITE® ABLESTIK QMI529HT, Syringe
LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.
- Electrically conductive
- Thermally conductive
- Void-free bondline
Availability: on demand
LOCTITE ABLESTIK QMI529HT, BMI/Acrylate, Die attach
Safety Data Sheet (SDS) on request