close

Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

  • My Wish List 0
  • My Cart 0

This is only a sample image of the product.

LOCTITE® ABLESTIK QMI536-1A1.5, Syringe

Henkel
LOCTITE® ABLESTIK QMI536-1A1.5 is a fluoropolymer filled paste for attachment of integrated circuits and components to advanced substrates and packages. LOCTITE ABLESTIK QMI536-1A1.5 can be cured in a conventional oven, on a snap cure oven, or utilize SkipCure™ processing on a die bonder or wire bonder. The material is formulated to produce cure onset below 100°C. This can reduce or eliminate the need to pre-dry organic substrates prior to the die attach process. LOCTITE ABLESTIK QMI536-1A1.5 is the 1.5 mil spacer version of LOCTITE ABLESTIK QMI536 adhesive.
    Availability: on demand
    Personal consultation
    Add to Wish List Add to Compare

    Safety Data Sheet (SDS) on request

    /H/e/Henkel_4742.jpg
    /l/o/loctite_logo_f5d5.JPG
    LOCTITE® ABLESTIK QMI536-1A1.5 is a fluoropolymer filled paste for attachment of integrated circuits and components to advanced substrates and packages. LOCTITE ABLESTIK QMI536-1A1.5 can be cured in a conventional oven, on a snap cure oven, or utilize SkipCure™ processing on a die bonder or wire bonder. The material is formulated to produce cure onset below 100°C. This can reduce or eliminate the need to pre-dry organic substrates prior to the die attach process. LOCTITE ABLESTIK QMI536-1A1.5 is the 1.5 mil spacer version of LOCTITE ABLESTIK QMI536 adhesive.
    Packaging type Syringe
    More Information
    BMC internal key 627341
    Regional availability on demand
    Brands LOCTITE®