LOCTITE® ABLESTIK QMI536NB, 10 cc Syringe
LOCTITE® ABLESTIK QMI536NB is a low bleed non conductive, PTFE-filled paste designed for stacked die applications which require very low stress and robust mechanical properties. The material has the same processing and properties of QMI536 but resin bleed is essentially eliminated. These features produce fast cure capability and enhanced reliability performance to a wide variety of surfaces, including solder resist, flexible tape, bare silicon and various die passivations. A package or device manufactured with this product will have high resistance to delamination and popcorning after multiple exposures to lead-free solder reflow temperatures.
- Stacked die application
- Low bleed
- High resistance
Availability: on demand
LOCTITE ABLESTIK QMI536NB, Bismaleimide Resin, Die Attach, Low Bleed Non-conductive, PTFE-filled Paste
Safety Data Sheet (SDS) on request