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LOCTITE® ECCOBOND 3707, 30 ml Syringe

Henkel
LOCTITE® ECCOBOND EN 3707 no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
  • Fast UV Cure
  • Good adhesion
  • Reworkable
  • Co-cure with UV curable conformal coating
Availability: on demand
Personal consultation
LOCTITE ECCOBOND EN 3707, Edgebond Underfill, Dual cure, fast UV, 1 component, epoxy
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Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND EN 3707 no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
Packaging type Syringe
More Information
BMC internal key 1345259
Regional availability on demand
Brands LOCTITE®