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LOCTITE® ECCOBOND 50500 D

Henkel
LOCTITE® ECCOBOND 50500 D is designed to be used as a dam encapsulant in combination with a "fill" encapsulant in glob top applications for protecting wire bonded bare IC's. This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required.
    Availability: on demand
    Personal consultation

    Safety Data Sheet (SDS) on request

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    LOCTITE® ECCOBOND 50500 D is designed to be used as a dam encapsulant in combination with a "fill" encapsulant in glob top applications for protecting wire bonded bare IC's. This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required.
    Packaging type Other types of packaging
    More Information
    Regional availability on demand
    Brands LOCTITE®