LOCTITE® ECCOBOND 50500 D
LOCTITE® ECCOBOND 50500 D is designed to be used as a dam encapsulant in combination with a "fill" encapsulant in glob top applications for protecting wire bonded bare IC's. This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required.
Availability: on demand
Safety Data Sheet (SDS) on request