LOCTITE® ECCOBOND E 1172 A, Part A
LOCTITE® ECCOBOND E 1172 A is an epoxy based, single component underfill that provides a uniform and void-free encapsulant underfill, maximizing the device's temperature cycling capability, distributing stress away from solder connects.This product cures fast at low temperatures and exhibits low CTE with long pot life.
- Void free underfill
- Single component
- Long pot life
- Fast Cure
Availability: on demand
LOCTITE ECCOBOND E 1172 A is a single component underfill for use with very fine area array devices where SMT transparent processing is critical.
Safety Data Sheet (SDS) on request