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LOCTITE® ECCOBOND E 3200

Henkel
LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
  • Fast and low temperature cure
  • Resilient
  • Sag resistant paste
  • Flexible epoxy
Availability: on demand
Personal consultation
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
Packaging type Other types of packaging
More Information
Regional availability on demand
Brands LOCTITE®