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LOCTITE® ECCOBOND E 3200

Henkel
LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
  • Fast and low temperature cure
  • Resilient
  • Sag resistant paste
  • Flexible epoxy
Availability: on demand
Personal consultation
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy
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Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
Packaging type Other types of packaging
More Information
BMC internal key 1188716
Regional availability on demand
Brands LOCTITE®