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LOCTITE® ECCOBOND EN 3707F, 55 cc Syringe

Henkel
LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
  • Dual cure
  • Fast UV cure
  • Cures in shadowed areas with heat
  • Easy dispensability without stringing
Availability: on demand
Personal consultation
LOCTITE ECCOBOND EN 3707F, Epoxy, Encapsulant

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND EN 3707F no flow encapsulant is designed for local circuit board protection. This adhesive cures in seconds when exposed to the appropriate intensity of UV light. In addition to light cure, this adhesive contains a secondary thermal cure initiator.
Packaging type Syringe
More Information
Regional availability on demand
Brands LOCTITE®