LOCTITE® ECCOBOND EN 3838T, 52 g Syringe
Henkel
LOCTITE® ECCOBOND EN 3838T is designed to provide an flexible, low Tg material for encapsulating components on a PCB. When cured, this material provides physical protection and stable electronic performance and protection in temperature/humidity/bias testing.
- Thixotropic
- Fast cure at moderate temperatures
- Low modulus
- Low Tg
Availability: on demand
LOCTITE ECCOBOND EN 3838T, Epoxy, Encapsulant
Safety Data Sheet (SDS) on request
