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LOCTITE® ECCOBOND FP4323, 30 cc Standard cartridge

Henkel
LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
  • Low CTE for improved thermal cycling
  • Thixotropic
  • High purity
  • Excellent moisture resistance
Availability: on demand
Personal consultation
LOCTITE ECCOBOND FP4323, Epoxy, Encapsulant - glob top

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
Chemical Base Epoxy
Curing Type Heat cure
Packaging type Cartridge
Physical appereance Liquid
More Information
BMC internal key 452111
Colour Black
Regional availability on demand
Brands LOCTITE®