LOCTITE® ECCOBOND FP4323, 35 cc Syringe
Henkel
LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the chip.
- Low CTE for improved thermal cycling
- Thixotropic
- High purity
- Excellent moisture resistance
Availability: on demand
LOCTITE ECCOBOND FP4323, Epoxy, Encapsulant - glob top
Safety Data Sheet (SDS) on request
