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LOCTITE® ECCOBOND FP4531, 55 cc Syringe

Henkel
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
  • Snap curable
  • Fast flow
  • Passes NASA outgassing
Availability: on demand
Personal consultation
LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE ECCOBOND FP4531 underfill is designed for flip chip on flex applications with a 1mil gap.
Chemical Base Epoxy
Curing Type Heat cure
Packaging type Syringe
More Information
BMC internal key 498773
Colour Black
Regional availability on demand
Brands LOCTITE®