LOCTITE® ECCOBOND FP4549, 10 cc Barrel/drum
LOCTITE® ECCOBOND FP4549 liquid epoxy adhesive is designed forenhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90°C to 110°C with as little as a 1/2 mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.
Availability: on demand
Safety Data Sheet (SDS) on request