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LOCTITE® ECCOBOND FP4549, 10 cc Barrel/drum

Henkel
LOCTITE® ECCOBOND FP4549 liquid epoxy adhesive is designed forenhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90°C to 110°C with as little as a 1/2 mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.
    Availability: on demand
    Personal consultation

    Safety Data Sheet (SDS) on request

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    LOCTITE® ECCOBOND FP4549 liquid epoxy adhesive is designed forenhanced adhesion to integrated circuit passivation materials. This material is formulated to quickly underfill devices at 90°C to 110°C with as little as a 1/2 mil gap. When fully cured, the material forms a rigid, low stress seal that dissipates stress on solder joints and extends thermal cycling performance.
    Packaging type Barrel
    More Information
    Regional availability on demand
    Brands LOCTITE®