LOCTITE® ECCOBOND NCP 5209, 10 cc
Henkel
LOCTITE® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide fluxing activity to allow solder joint formation and bump protection reliability in flip chip bonding processes.
- High purity
- Non-conductive
- Excellent protection of electrical joints
- Compatible with small assembly gap and tight pitches
Availability: on demand
Safety Data Sheet (SDS) on request
