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LOCTITE® ECCOBOND NCP 5209, 10 cc

Henkel
LOCTITE® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide fluxing activity to allow solder joint formation and bump protection reliability in flip chip bonding processes.
  • High purity
  • Non-conductive
  • Excellent protection of electrical joints
  • Compatible with small assembly gap and tight pitches
Availability: on demand
Personal consultation
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Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND NCP 5209 is designed for thermal compression bonding processes in flip chip to laminate assembly. LOCTITE ECCOBOND NCP 5209 is a non-conductive paste adhesive designed for advanced flip chip Cu pillar applications. It is formulated to be pre-applied to the subtrate and provide fluxing activity to allow solder joint formation and bump protection reliability in flip chip bonding processes.
Packaging type Other types of packaging
More Information
BMC internal key 1859304
Regional availability on demand
Brands LOCTITE®