close

Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

  • My Wish List 0
  • My Cart 0

This is only a sample image of the product.

LOCTITE® ECCOBOND UF 1173, Standard cartridge

Henkel
LOCTITE® ECCOBOND UF 1173 is an epoxy based, single component underfill which maximizes the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. It has a long pot life and exhibits low CTE.
  • Single component
  • Void free underfill
  • Long pot life
  • Low CTE
Availability: on demand
Personal consultation
LOCTITE ECCOBOND UF 1173 is a single component product designed to provide a uniform and void-free encapsulant underfill.
Add to Wish List Add to Compare

Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

/H/e/Henkel_4742.jpg
/l/o/loctite_logo_f5d5.JPG
LOCTITE® ECCOBOND UF 1173 is an epoxy based, single component underfill which maximizes the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. It has a long pot life and exhibits low CTE.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Cartridge
Physical appereance Liquid
More Information
BMC internal key 2905491
Colour Black
Regional availability on demand
Brands LOCTITE®