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LOCTITE® ECCOBOND UF 1173, Syringe

Henkel
LOCTITE® ECCOBOND UF 1173 is an epoxy based, single component underfill which maximizes the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. It has a long pot life and exhibits low CTE.
  • Single component
  • Void free underfill
  • Long pot life
  • Low CTE
Availability: on demand
Personal consultation
LOCTITE ECCOBOND UF 1173 is a single component product designed to provide a uniform and void-free encapsulant underfill.
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND UF 1173 is an epoxy based, single component underfill which maximizes the device's temperature cycling capability, distributing stress away from solder connects thus enhancing solder joint reliability in CSP and BGA packages. It has a long pot life and exhibits low CTE.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Syringe
Physical appereance Liquid
More Information
BMC internal key 2420247
Colour Black
Regional availability on demand
Brands LOCTITE®