close

Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

  • My Wish List 0
  • My Cart 0

This is only a sample image of the product.

LOCTITE® ECCOBOND UF 3808, 30 ml Syringe

Henkel
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
  • High Tg
  • Reworkable
  • Low CTE
  • Room temperature flow capability
Availability: on demand
Personal consultation
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill
Add to Wish List Add to Compare

Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

/H/e/Henkel_4742.jpg
/l/o/loctite_logo_f5d5.JPG
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
Packaging type Syringe
More Information
BMC internal key 1679643
Regional availability on demand
Brands LOCTITE®