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LOCTITE® ECCOBOND UF 3808, 30 ml Syringe

Henkel
LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
  • High Tg
  • Reworkable
  • Low CTE
  • Room temperature flow capability
Availability: on demand
Personal consultation
LOCTITE ECCOBOND UF 3808, Epoxy, Underfill
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND UF 3808 capillary underfill is designed to cure quickly at low temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
Packaging type Syringe
More Information
BMC internal key 1679643
Regional availability on demand
Brands LOCTITE®