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LOCTITE® ECCOBOND UF 3810, 50 ml Syringe

Henkel
LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
  • Fast cure at moderate temperatures
  • Halogen free
  • High Tg
  • Compatible with most Pb-free solders
Availability: on demand
Personal consultation
LOCTITE ECCOBOND UF 3810, Epoxy, Underfill
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND UF 3810 reworkable epoxy underfill is designed for CSP and BGA applications. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material provides excellent mechanical properties to protect solder joints during thermal cycling.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Syringe
Physical appereance Liquid
More Information
BMC internal key 1623008
Colour Black
Regional availability on demand
Brands LOCTITE®