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Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

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LOCTITE® ECCOBOND UF 3811, 50 ml Barrel/drum

Henkel
LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.
  • Room temperature flow capability
  • Low viscosity material flows at room temperature with no additional preheating required
  • High Tg while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing
  • Cures quickly at moderate temperatures to minimize stress to other components
Availability: on demand
Personal consultation
LOCTITE ECCOBOND UF 3811, Halogen free, Reworkable, Low viscosity, Epoxy, Underfill, Encapsulant

Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND UF 3811 reworkable epoxy underfill is designed for CSP and BGA applications. This low viscosity material is formulated to flow at room temperature with no additional preheating required. It cures quickly at moderate temperatures to minimize stress to other components. When cured, this material has a high glass transition temperature while maintaining flexibility in order to protect solder joints during thermal cycling and drop testing.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Barrel
More Information
BMC internal key 1824593
Colour Black
Regional availability on demand
Brands LOCTITE®