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LOCTITE® ECCOBOND UF 3820, Syringe

Henkel
LOCTITE® ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
  • Halogen free
  • Easy rework
  • High Tg
  • One component
Availability: on demand
Personal consultation
LOCTITE ECCOBOND UF 3820, Epoxy, Underfill
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Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND UF 3820 reworkable underfill is specially designed for CSP, WLCSP and BGA applications. It is formulated to cure quickly at moderate temperatures to minimize stress to other components. This material's high glass transition temperature and high fracture toughness enables excellent protection of solder joints during thermal cycling.
Packaging type Syringe
More Information
BMC internal key 2094821
Regional availability on demand
Brands LOCTITE®