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LOCTITE® ECCOBOND UF 8830S, Syringe

Henkel
LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.
  • Improved toughness
  • Low CTE
  • High purity
  • High TG
Availability: on demand
Personal consultation
LOCTITE ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow.

Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND UF 8830S liquid epoxy underfill encapsulant is formulated for tight bump pitch and narrow gap in flip chip BGA applications. It is designed to improve crack/fracture resistance and deliver faster flow. When fully cured, this material forms a rigid, low stress seal that dissipates stress in solder joints and extends thermal cycling performance.
Chemical Base Epoxy
Curing Type Heat cure
Packaging type Syringe
Physical appereance Paste
More Information
BMC internal key 2017490
Colour Grey
Regional availability on demand
Brands LOCTITE®