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LOCTITE® ABLESTIK 813J01 BIPAX

Henkel
LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is non-corrosive and will not revert when exposed to high temperatures.
  • Excellent thermal conductivity
  • Bonds well to difficult substrates
  • Low stress
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 813J01 BIPAX, Silicone, Non-corrosive, Encapsulant

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 813J01 BIPAX exhibits very low stress upon cure thus preventing component cracking and other stress-related problems. This adhesive can be cured at room temperature in thick or thin sections. It is non-corrosive and will not revert when exposed to high temperatures.
Packaging type Other types of packaging
More Information
BMC internal key 1437389
Regional availability on demand
Brands LOCTITE®