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LOCTITE® ABLESTIK 84-1LMI

Henkel
LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe.
  • Electrically conductive
  • Low bleed
  • Low outgassing
Availability: on demand
Personal consultation
LOCTITE ABLESTIK 84-1LMI, Epoxy, Die attach
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK 84-1LMI die attach adhesive is designed for microelectronic chip bonding applications. This adhesive is ideal for application by automatic dispenser or hand probe.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Other types of packaging
More Information
BMC internal key 1199488
Colour Silver
Regional availability on demand
Brands LOCTITE®