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LOCTITE® ABLESTIK ABP 8064T

Henkel
LOCTITE® ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.
  • High thermal conductivity
  • High electrical conductivity
  • Medium modulus
  • Low outgassing
Availability: on demand
Personal consultation
LOCTITE ABLESTIK ABP 8064T, Hybrid chemistry, Die Attach
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.
Packaging type Other types of packaging
More Information
BMC internal key 2708791
Regional availability on demand
Brands LOCTITE®