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LOCTITE® ABLESTIK QMI529HT

Henkel
LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.
  • Electrically conductive
  • Thermally conductive
  • Void-free bondline
  • Hydrophobic
Availability: on demand
Personal consultation
LOCTITE ABLESTIK QMI529HT, BMI/Acrylate, Die attach
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Safety Data Sheet (SDS) on request

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LOCTITE® ABLESTIK QMI529HT die attach paste was developed as a soft-solder replacement or for high UPH performance applications. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater.
Packaging type Other types of packaging
More Information
BMC internal key 1462727
Regional availability on demand
Brands LOCTITE®