LOCTITE® ECCOBOND E 3200
Henkel
LOCTITE® ECCOBOND E 3200 was designed as a chemically resistant, fast and low temperature heat curing adhesive for bonding dissimilar engineering substrates.
- Fast and low temperature cure
- Resilient
- Sag resistant paste
- Flexible epoxy
Availability: on demand
LOCTITE ECCOBOND E 3200, Sag resistant, Flexible, Assembly, Epoxy
Safety Data Sheet (SDS) on request