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LOCTITE® ECCOBOND FIL 7010C

Henkel
LOCTITE® ECCOBOND FIL 7010C is a low viscosity, one component epoxy product designed for use as a potting or encapsulation resin protection for stress sensitive electronic components. It is specially formulated with a low thermal expansion and high Tg, along with a toughened polymer backbone making it ideally suited to survive severe thermal shock conditions with a high resistance to micro cracking. LOCTITE ECCOBOND FIL 7010C is designed to survive constant service temperatures of 150°C, with peak temperatures of up to 180°C.
  • Crack and thermal resistant
  • Good chemical resistance
  • Low thermal expansion
  • High purity
Availability: on demand
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LOCTITE ECCOBOND FIL 7010C, one component epoxy
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Technical Data Sheet (TDS)

Safety Data Sheet (SDS) on request

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LOCTITE® ECCOBOND FIL 7010C is a low viscosity, one component epoxy product designed for use as a potting or encapsulation resin protection for stress sensitive electronic components. It is specially formulated with a low thermal expansion and high Tg, along with a toughened polymer backbone making it ideally suited to survive severe thermal shock conditions with a high resistance to micro cracking. LOCTITE ECCOBOND FIL 7010C is designed to survive constant service temperatures of 150°C, with peak temperatures of up to 180°C.
Chemical Base Epoxy
Number of Components 1_component_system
Curing Type Heat cure
Packaging type Other types of packaging
More Information
BMC internal key 2648764
Colour Black
Regional availability on demand
Brands LOCTITE®