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Attention: Between December 19, 2024, and January 2, 2025, orders will still be accepted, but no order processing will take place during this time. We appreciate your understanding.

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LOCTITE® ECCOBOND UF 4550HTC

Henkel
LOCTITE® ECCOBOND UF 4550HTC is a board level capillary underfill designed to provide enhanced thermal properties and adhesion to integrated circuit passivation material and flex circuits. LOCTITE ECCOBOND UF 4550HTC is designed to quickly underfill at elevated substrate temperature of 90 to 110 °C. LOCTITE ECCOBOND UF 4550HTC provides thermal conductivity for applications where thermal management is required. This material is also engineered to provide good thermal cycle reliability for PCBAs.
    Availability: on demand
    Personal consultation
    LOCTITE ECCOBOND UF 4550HTC, board level capillary underfill, jet dispensable
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    Safety Data Sheet (SDS) on request

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    LOCTITE® ECCOBOND UF 4550HTC is a board level capillary underfill designed to provide enhanced thermal properties and adhesion to integrated circuit passivation material and flex circuits. LOCTITE ECCOBOND UF 4550HTC is designed to quickly underfill at elevated substrate temperature of 90 to 110 °C. LOCTITE ECCOBOND UF 4550HTC provides thermal conductivity for applications where thermal management is required. This material is also engineered to provide good thermal cycle reliability for PCBAs.
    Packaging type Other types of packaging
    More Information
    BMC internal key 2670326
    Regional availability on demand
    Brands LOCTITE®