BERGQUIST GAP PAD TGP 10000ULM
Henkel
BERGQUIST GAP PAD TGP 10000ULM is an extremely soft
gap filling material rated at a thermal conductivity of 10.0
W/m-K. It is specially formulated for high performance
applications requiring low assembly stress. The material offers exceptional thermal performance at low pressures due to the unique filler package and ultra low modulus resin formulation. ultra low modulus (ULM)
Following Dimensions with are available
(Delivery form, Thickness, Width, Length)
sheet 1.52 203 203.00
sheet 1.02 203 203.00
sheet 2.03 203 203.00
sheet 2.54 203 203.00
sheet 3.18 203 203.00
This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
- Thermal conductivity: 10 W/m-K
- Ultra-low modulus design easily conforms and adheres to irregular surfaces
- Low compression stress
- High-compliance
Availability: on demand
BERGQUIST GAP PAD TGP 10000ULM is a soft gap pad filler with ultra low modulus (ULM) and exceptional thermal conductivity of 10.0W/m-K.
Safety Data Sheet (SDS) on request
