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BERGQUIST GAP PAD TGP 12000ULM

Henkel
Ultra low modulus (ULM), Unreinforced, Thermal conductivity: 12 W/m-K Exceptional thermal performance at low pressures Ultra-low modulus allows for excellent adhesion to rough surfaces High-compliance, -60 to 200ºC Following Dimensions with are available (Delivery form, Thickness, Width, Length) sheet 1.52 203 203.00 sheet 1.02 203 203.00 sheet 2.03 203 203.00 sheet 2.54 203 203.00 sheet 3.18 203 203.00 Unreinforced with natural tack on both sides This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
  • Thermal conductivity: 12 W/m-K
  • Exceptional thermal performance at low pressures
  • Ultra-low modulus allows for excellent adhesion to rough surfaces
  • High-compliance
Availability: on demand
Persönliche Beratung
BERGQUIST GAP PAD TGP 12000ULM is an extremely soft gap pad filler with a thermal conductivity rating of 12.0 W/m-K and is specially formulated for high performance applications.

Safety Data Sheet (SDS) on request

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Ultra low modulus (ULM), Unreinforced, Thermal conductivity: 12 W/m-K Exceptional thermal performance at low pressures Ultra-low modulus allows for excellent adhesion to rough surfaces High-compliance, -60 to 200ºC Following Dimensions with are available (Delivery form, Thickness, Width, Length) sheet 1.52 203 203.00 sheet 1.02 203 203.00 sheet 2.03 203 203.00 sheet 2.54 203 203.00 sheet 3.18 203 203.00 Unreinforced with natural tack on both sides This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
More Information
BMC internal key BERGQUIST GAP PAD TGP 12000ULM
Regional availability on demand
Brands BERGQUIST®