BERGQUIST GAP PAD TGP 12000ULM
Henkel
Ultra low modulus (ULM), Unreinforced, Thermal conductivity: 12 W/m-K
Exceptional thermal performance at low pressures
Ultra-low modulus allows for excellent adhesion to rough surfaces High-compliance, -60 to 200ºC
Following Dimensions with are available
(Delivery form, Thickness, Width, Length)
sheet 1.52 203 203.00
sheet 1.02 203 203.00
sheet 2.03 203 203.00
sheet 2.54 203 203.00
sheet 3.18 203 203.00
Unreinforced with natural tack on both sides
This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
- Thermal conductivity: 12 W/m-K
- Exceptional thermal performance at low pressures
- Ultra-low modulus allows for excellent adhesion to rough surfaces
- High-compliance
Availability: on demand
BERGQUIST GAP PAD TGP 12000ULM is an extremely soft gap pad filler with a thermal conductivity rating of 12.0 W/m-K and is specially formulated for high performance applications.
Safety Data Sheet (SDS) on request
