BERGQUIST GAP PAD TGP 3004SF
Henkel
Thermal conductivity: 3 W/m-K, Silicone free
UL94 V-0 compliance, Reworkable, based on a PET film as carrier
Following Dimensions with are available
(Delivery form, Thickness, Width, Length)
sheet 1.52 229 457.00
sheet 0.25 229 457.00
sheet 0.41 229 457.00
sheet 0.51 229 457.00
sheet 0.76 229 457.00
sheet 1.02 229 457.00
sheet 2.03 229 457.00
sheet 2.54 229 457.00
sheet 3.18 229 457.00
This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
- Thermal conductivity: 3 W/m-K
- Silicone free
- UL94 V-0 compliance
- Reworkable
Availability: on demand
BERGQUIST GAP PAD TGP 3004SF is a high perfromance, silicone free, thermally conductive gap pad ideal for silicone sensitive applications.
Safety Data Sheet (SDS) on request
