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BERGQUIST GAP PAD TGP 3004SF

Henkel
Thermal conductivity: 3 W/m-K, Silicone free UL94 V-0 compliance, Reworkable, based on a PET film as carrier Following Dimensions with are available (Delivery form, Thickness, Width, Length) sheet 1.52 229 457.00 sheet 0.25 229 457.00 sheet 0.41 229 457.00 sheet 0.51 229 457.00 sheet 0.76 229 457.00 sheet 1.02 229 457.00 sheet 2.03 229 457.00 sheet 2.54 229 457.00 sheet 3.18 229 457.00 This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
  • Thermal conductivity: 3 W/m-K
  • Silicone free
  • UL94 V-0 compliance
  • Reworkable
Availability: on demand
Persönliche Beratung
BERGQUIST GAP PAD TGP 3004SF is a high perfromance, silicone free, thermally conductive gap pad ideal for silicone sensitive applications.

Safety Data Sheet (SDS) on request

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Thermal conductivity: 3 W/m-K, Silicone free UL94 V-0 compliance, Reworkable, based on a PET film as carrier Following Dimensions with are available (Delivery form, Thickness, Width, Length) sheet 1.52 229 457.00 sheet 0.25 229 457.00 sheet 0.41 229 457.00 sheet 0.51 229 457.00 sheet 0.76 229 457.00 sheet 1.02 229 457.00 sheet 2.03 229 457.00 sheet 2.54 229 457.00 sheet 3.18 229 457.00 This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
More Information
BMC internal key BERGQUIST GAP PAD TGP 3004SF
Regional availability on demand
Brands BERGQUIST®