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BERGQUIST SIL PAD TSP Q2000

Henkel
Electrically conductive, fibreglass reinforced pad - withstands processing stress like solder baths Following Dimensions with are available (Delivery form, Thickness, Width, Length) roll 0.13 305 76.20 sheet 0.13 305 305.00 Also available with Adhesive on one side (Delivery form, Thickness, Width, Length) roll 0.13 305 76.20 sheet 0.13 305 305.00 This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
  • Thermal impedance: 0.35°C-in2/W (@50 psi)
  • Eliminates processing constraints typically associated with grease
  • Easy handling
  • Conforms to surface textures
Availability: on demand
Persönliche Beratung
BERGQUIST SIL PAD TSP Q2000, Fiberglass-Reinforced, Silicone based, Grease Replacement Thermal Interface
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Safety Data Sheet (SDS) on request

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Electrically conductive, fibreglass reinforced pad - withstands processing stress like solder baths Following Dimensions with are available (Delivery form, Thickness, Width, Length) roll 0.13 305 76.20 sheet 0.13 305 305.00 Also available with Adhesive on one side (Delivery form, Thickness, Width, Length) roll 0.13 305 76.20 sheet 0.13 305 305.00 This material can be cutted by the Bodo Möller Cutting Competence Center according to your template
More Information
BMC internal key BERGQUIST SIL PAD TSP Q2000
Regional availability on demand
Brands BERGQUIST®