BERGQUIST TGR 4000

BERGQUIST TGR 4000 is a thermally conductive grease compound designed for use as a thermal interface material between a computer processor and a copper-based heat sink. Other high watt density applications will benefit from the extremely low thermal impedance of BERGQUIST TGR 4000. The BERGQUIST TGR 4000 compound wets-out the thermal interface surfaces and flows to produce the lowest thermal impedance. The compound requires pressure of the assembly to cause flow. BERGQUIST TGR 4000 compound will not drip. For a typical 0.5'' x 0.5'' application at 0.005'' thick, Bergquist estimates approximately 0.02 ml (cc) of BERGQUIST TGR 4000. Although Bergquist estimates a 0.02 ml (cc) volumetric requirement for a 0.5'' x 0.5'' component interface, dispensed at a thickness of 0.005'', Bergquist also recognizes that an optimized application would utilize the minimum volume of BERGQUIST TGR 4000 material necessary to ensure complete wet-out of both mechanical interfaces. TYPICAL APPLICATIONS ● High performance computer processors (traditional screw fastening or clamping methods will provide adequate force to optimize the thermal performance of BERGQUIST TGR 4000) ● High watt density applications where the lowest thermal resistance interface is required