GAP-FILLER 1000
Henkel
BERGQUIST GAP FILLER TGF 1000 is a thermally
conductive, liquid gap filling material. It is supplied as a
two-component, room or elevated temperature curing system.
The material is formulated to provide a balance of cured
material properties highlighted by a low modulus and good
compression set (memory). The result is a soft, thermally
conductive, form-in-place elastomer ideal for coupling “hot”
electronic components mounted on PC boards with an
adjacent metal case or heat sink.
Before cure, BERGQUIST GAP FILLER TGF 1000 flows under
pressure like a grease. After cure, it does not pump from the
interface as a result of thermal cycling. Unlike thermal grease,
the cured product is dry to the touch. Unlike cured gap filling
materials, the liquid approach offers infinite thickness with little
or no stress during displacement and eliminates the need for
specific pad thickness and die-cut shapes for individual
applications. BERGQUIST GAP FILLER TGF 1000 is intended
for use in thermal interface applications when a strong
structural bond is not required.
TYPICAL APPLICATIONS
● Automotive electronics (HEV, NEV, batteries)
● Computer and peripherals
● Between any heat-generating semiconductor and a heat
sink
● Telecommunications
● Thermally conductive vibration dampening
- Liquid thermal Conductive Gap Filler
- 1 THERMAL CONDUCTIVITY (W/m-K)
- Viscosity 100'000 Mpa's
- Grey Color
- UL94, V0
Availability: on demand
Excellent slump resistance (stays in place) Excellent low and high temperature mechanical andchemical stability Ultra-conforming, with excellent wet-out for low stress interface applications
Safety Data Sheet (SDS) on request
