GAP-FILLER 3600
Henkel
BERGQUIST GAP FILLER TGF 3600 is a two-component
liquid gap filling material, cured at either room or elevated
temperature, featuring ultra-high thermal performance and
superior softness. Prior to curing, the material maintains
good thixotropic characteristics as well as low viscosity.
The result is a gel-like liquid material designed to fill air gaps
and voids yet flow when acted upon by an external force
(e.g. dispensing or assembly process). The material is an
excellent solution for interfacing fragile components with high
topography and/or stack-up tolerances to a universal heat
sink or housing.
Once cured, it remains a low modulus elastomer designed to
assist in relieving CTE stresses during thermal cycling yet
maintain enough modulus to prevent pump-out from the
interface. BERGQUIST GAP FILLER TGF 3600 will lightly
adhere to surfaces, thus improving surface area contact.
BERGQUIST GAP FILLER TGF 3600 is not designed to be a
structural adhesive.
TYPICAL APPLICATIONS
● Automotive electronics (HEV, NEV, batteries)
● PCBA to housing
● Discrete components to housing
● Fiber optic telecommunications equipment
- Liquid thermal Conductive Gap Filler
- 3.6 THERMAL CONDUCTIVITY (W/m-K)
- Viscosity 150'000 Mpa's
- Blue Color
Availability: on demand
product has low modulus to help relieves CTE stresses in thermal cycling and also provide excellent vertical gap stability, Thixotropic nature makes it easy to dispense, Two-part formulation for easy storage, Ultra-conforming, designed for fragile and low
Safety Data Sheet (SDS) on request
